SiC Polishing Plate

SiC Polishing Plate

Reduces deformation due to heat. Excellent chemical resistance and suitable for various surface shape processing.

Single-wafer polishing plate with high thermal conductivity, low coefficient of thermal expansion, high Young's modulus, excellent heat uniformity, and minimal plate deformation due to heat. It also has excellent chemical resistance and can be processed into various shapes, such as convex, concave, and flat, for plate surface processing.

Keywords: high Young's modulus, low thermal expansion, high thermal conductivity, chemical resistance, uniform temperature

Product data

SiC Polishing Plate
Material Silicon carbide (SiC)
Shape Convex, concave, and flat surfaces are available
Size MAXφ30"
Accuracy Flatness 1 μm or less
Application example Wafer fixing jig