Porous ceramic chuck
Typical examples are 55μm (standard), 120μm, 10μm, and 2μm. If the surface is rough, the air permeability will increase, and the adsorption force will be strong, but the adsorption force will be greatly reduced due to air leakage. If it is fine, partial adsorption that does not cover the entire porous surface is possible, and thinner workpieces can also be adsorbed.
Product data
| Porous ceramic chuck | |
|---|---|
| Porous material | |
| Alumina Ceramic | Standard specifications. Excellent processing accuracy, pore uniformity, and cost performance. |
| SiC (Silicon Carbide) | Used as a countermeasure against static electricity (volume resistivity: 10 7Ω cm) |
| SUS (Stainless Steel) | Porous conductor |
| Resin | Soft material that does little damage to the suction work |
| Porous pore diameter | |
| 2μm ~ 230μm compatible | Typical examples are 55μm (standard), 120μm, 10μm, and 2μm. If the surface is rough, the air permeability will increase, and the adsorption force will be strong, but the adsorption force will be greatly reduced due to air leakage. If it is fine, partial adsorption that does not cover the entire porous surface is possible, and thinner workpieces can also be adsorbed. |
| Colour | Only alumina ceramic porous can be selected. Black (standard), white, dark blue, blue, brown etc. |
| Body material | |
| SUS (Stainless Steel) | High rigidity and high precision processing are possible. Excellent cost performance. Typical examples: SUS303, SUS430, SUS440C, etc. |
| Aluminium | Weight reduction is possible. Typical examples: A5052, A5056, A6061, A7075, etc. |
| Ceramic | Lightweight and capable of high-precision processing. Typical examples: alumina ceramics, SiC. |
| Body surface processing | |
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| Shape | |
| Round type φ5mm ~ φ500mm | |
| Square type □5mm ~ □500mm | |
| ※ It is possible to customize each time according to the shape and specifications of the suction work. We make proposals based on the image of the desired shape and design and drawing. | |
| Application field | |
| Semiconductor | Bonding, dicing, tape mounting, polishing, etc. |
| LED | Screen printing, paper manufacturing, application inspection, image measurement, inkjet printing, etc. |
| Food | Adsorption transportation of food, food packing, food spraying, etc. |
| Other manufacturing | Metal processing, machining, laser processing, etc. |