Our wafer transfer system utilizes clean robotics.
300mm wafers are transported one by one to cassettes (containers) A to B.
Compatible cassettes (containers) are FOUP, FOSB, OPEN, and PFA.
The standard transport is in units of 1 sheet, but transport in units of 5 or 25 sheets is also available.
Wafers can be safely transported collectively between cassettes.
Since wafers are lifted from the cassette for loading/unloading, contact with the cassette is minimized to prevent wear, dust generation, and damage to the wafer edge. Wafer mapping detects loading errors such as wafer misalignment and double stacking with error prevention sensors and emergency stop buttons.
Wafer Transfer Equipment | |
---|---|
Work | Semiconductor substrate |
Work size | 300mm |
Work thickness | 600〜850μm |
Power supply | AC200V, 15A |
Cassette (container) | FOUP・FOSB・OPEN・PFA |
Throughput | 25 sheets/1 cassette transfer time 300 seconds or less |
Drive system | Motor drive (servo) |
Equipment weight | About 500kg |
Equipment size | W1000×D1400×H1800(mm) |
Transportation unit | 1 unit ・ 5 units ・ 25 units |
Safety mechanism | Presence of cassette, presence of wafer, overload detection, error alarm, emergency stop |
Option | Static eliminator (ionizer), full cover, area sensor ID reader, alignment, wafer flipping, etc. |
Features |
|
Case study | Want to transport wafers easily. Want to suppress the rubbing of the workpiece in the cassette. |
Considerable | Number of cassette stages, automation, work size, etc. |
Usage |
|