Wafer Transfer Equipment

Wafer Transfer Equipment

Our wafer transfer system utilizes clean robotics.
300mm wafers are transported one by one to cassettes (containers) A to B.
Compatible cassettes (containers) are FOUP, FOSB, OPEN, and PFA.
The standard transport is in units of 1 sheet, but transport in units of 5 or 25 sheets is also available.
Wafers can be safely transported collectively between cassettes.
Since wafers are lifted from the cassette for loading/unloading, contact with the cassette is minimized to prevent wear, dust generation, and damage to the wafer edge. Wafer mapping detects loading errors such as wafer misalignment and double stacking with error prevention sensors and emergency stop buttons.


Wafer Transfer Equipment
Work Semiconductor substrate
Work size 300mm
Work thickness 600〜850μm
Power supply AC200V, 15A
Cassette (container) FOUP・FOSB・OPEN・PFA
Throughput 25 sheets/1 cassette transfer time 300 seconds or less
Drive system Motor drive (servo)
Equipment weight About 500kg
Equipment size W1000×D1400×H1800(mm)
Transportation unit 1 unit ・ 5 units ・ 25 units
Safety mechanism Presence of cassette, presence of wafer, overload detection, error alarm, emergency stop
Option Static eliminator (ionizer), full cover, area sensor
ID reader, alignment, wafer flipping, etc.
  • Space saving
  • Anti-static type
  • Error monitoring with optical and mechanical sensors
  • with mapping sensor
  • Compatible with FOUP・FOSB・H-Square metal cassettes
  • Class 10 clean room compatible
Case study Want to transport wafers easily.
Want to suppress the rubbing of the workpiece in the cassette.
Considerable Number of cassette stages, automation, work size, etc.
  1. Case used by equipment manufacturers

    • ① Wafers for evaluation are provided by device manufacturers in FOSB (shipping cases).
    • ② Transfer to a carrier (for example, FOUP) used in the equipment manufacturer's system.
    • ③ Transfer the wafer after evaluation to the FOSB. (returned to device manufacturer).

    Equipment manufacturer example

    Etching equipment, ashing equipment, cleaning equipment, coater developer, exposure equipment, etc.

  2. Case used by wafer makers

    • ① Transfer completed wafers (after completion of final cleaning and inspection) to FOSB (shipping case).
    • ② Transfer to PFA carrier (cleaning carrier) between processes (cleaning process, etc.).